ENG
ENG KOR

Business

Business Field

TEST INTERFACE DEVICE
AND PARTS

Board Business of Burn-In-Board

Main Products

Come and see the various products of the BeLINK`s board business!

Burn-In Board

Test Board (BIB)

It is a test board that filters out the products to detect
any early failures at high temperatures by applying electrical stress

Test Board (BIB) Technology

- Manufacturing technology for any brands of equipment (Korea / Japan / USA)
- The capability of manufacturing technology of high-speed burn-in board (Max: 200MHz)
- Design and manufacturing experiences in all fields: DRAM / NAND / SYSTEM semiconductor
- Preoccupancy with competitiveness by securing excellent design personnel

Hi-Fix Board

Hi-Fix Board & Load Board

A board that focuses on evaluating the electrical
characteristics of a device, transmits signals and power
required for the test between ATE and device.

Hi-fix Board Technology

- The capability of designing all test equipment as multiple sites (Max: 1,024 Para)
- The capability of design and manufacturing technology of DRAM / NAND (Including SSD equipment) / Load Board
- Excellent in designing new products through establishing relationships with the equipment manufacturer.

Probe Card

Main Products

Come and see the various products of the parts business of BeLINK !

Probe Card

  • Support for various products.
    Cantilever / Vertical / MEMS Type

  • Support for testing semiconductors of high difficulty and high integration.

  • Customizing for WLCSP Type inspection.

  • Support for Hi-Voltage and Hi-Current inspections.

Socket

  • Test Socket and Test Probe Pin, which play a mechanical role in checking the electrical operation status of semiconductors, are consumable components that act as adapters so that test equipment can be compatible with various types of semiconductor chips, and actively respond to customer needs through multiple-product and customized production.

  • We provide comprehensive and optimal total solutions for customers, such as test socket for BGA, LGA, QFN, QFP, CSP, TSOP, SOP, test sockets for multi-sites, and PoP.

  • Test probe pin utilizes various products such as pogo pin, MEMS, and rubber to support the fine pitch and high speed.

Semiconductor Test Process
and Business Area

Semiconductor Production Process Flow Tester

Facility Possession Status

It is important to ensure the reliability of products to meet the needs of increasingly integrated and complex semiconductor manufacturing customers.
Therefore, BeLINK is doing its best to develop the technology with expensive tools and equipment

PRVX4
NIKON 3D Measuring Machine
(NEXIV 4540TZ)
PROBE TESTER
(PCM1000)
Network Analyzer
(MS46524B)
Oscilloscope
Simulation Software
About Us Business Products Contact Us

Head Office : 610, 124, Sagimakgol ro, Jungwon gu, Seongnam si, Gyeonggi do, Republic of Korea

Dongtan R&D center : 1806, A, 27, Dongtan cheomdan saneop 1 ro, Hwaseong si, Gyeonggi do, Republic of Korea

TEL : +82-31-784-7060 | FAX : +82-31-784-8894

Copyrght(c) 2023. BeLINK.co.,ltd. All Rights Reserved