KOR

Product

Test Interface Board

Test Interface Board

Hybrid Burn-In Board

  • ▶ SPEED MAX 200Mhz

    ▶ DDR, LPDDR 

    ▶ Min Pitch : 0.35mm

  • 1. Multi layer, Fine pitch PCB설계

    2. SI & PI Simulation 대응

    3. 병렬 테스트 가능. Max 352

Max Layer

~18 Layer

Thickness

~2.4mm

Size

450*570

Material

Polyimide

Min Pitch

0.35 mm Pitch

Option

-

Impedance Control

50ohm [+/- 10%]